The 12th Summit Forum: Strengthening the Subdivision Application of Flip Chips

[Text|High- tech LED reporter Yue Mengdi] Gaogong LED CEO Dr. Zhang Xiaofei once pointed out that the current booming LED industry is an excellent opportunity for the entire industry chain.

However, not all companies can take advantage of this opportunity.

"At present, the biggest problem facing upstream epitaxial chip companies is that they will not increase their revenues." Wang Lianghai, vice president of Tongfang, said at the recent G20-LED lighting summit that although the chips are still in short supply in the first half of this year, the prices have not rebounded. The decline has stabilized. To solve this problem, capital integration and product upgrades are particularly important.

After the development of domestic chip manufacturers in recent years, the production capacity has been further released. The gross profit margin of the packaged chips is getting lower and lower. To maintain and improve its market share, flip-chips with more advantages and higher gross profit margins have emerged.

LED flip chip means that the chip can be directly bonded to the ceramic substrate without soldering wire. Compared with the front mounted chip, it does not need to be cooled by sapphire. The heat dissipation performance of the product is improved and can withstand greater current drive. In today's market for enhanced sub-applications, flip-chips are consistently optimistic by upstream, downstream and downstream companies for their high efficiency, high performance, high reliability and stability.

All the investments are profitable. It is precisely because of the novelty and advanced nature of the flip chip concept that the pursuit of it in the market is eager. The gradual maturity of technology and rapid improvement in cost performance have also led to the growth of LED flip chip penetration and market confidence.

In addition to Tongfang shares, other domestic chip companies have begun to deploy in the field of flip chip.

Huacan Optoelectronics also began to pay attention to flip chip very early. "About 80% of the chips used in the optoelectronic packaging are horizontal structures, about 10% are vertical chips, and the other 10% are flip-chips." Dr. Wang Jiangbo, vice president of research and development at Huacan Optoelectronics, pointed out that flip-chip LED chips are used in lighting and backlight applications. It is the best solution for super-current drive, and the future development prospects are considerable.

Although flip-chips are currently at a lower cost than high-end chips, the technology is not mature enough, but with the advancement of technology and large-scale applications, the advantages of flip-chip in lighting applications. Will be more obvious.

However, the cost reduction is not enough to make flip-chips stand firm and grow in the market. Its market space is more dependent on the cooperation of the entire industry chain.

Ye Guoguang, the sales director of Guangdong Deli Optoelectronics Co., Ltd., told reporters that he believes that the biggest factor restricting the development of flip chip is that package manufacturers and flip chip manufacturers are not matched. Only by solving the application problem, flip-chips can “grow and grow”, highlighting its advantages and market value.

On September 26th, 14:00-17:30, September 27th, 9:30-17:30, "The 12th High-tech LED Industry Summit Forum and LED Supply Chain Brand Summit" will be held at Guangzhou Pazhou Canton Fair. (2014 High-tech LED Exhibition held concurrently). At that time, the meeting will invite Wang Lianghai, vice president of Tongfang Co., Ltd., to discuss with the LED industry peers whether the flip chip can “turn over the road”.

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