With the slowdown in demand growth in downstream lighting applications and the large-scale expansion of upstream epitaxial chip companies in the past two years, the competition for domestic LED chips and packaged devices has entered a stage of white-hot.
In the field of chips, flip-chip technology is emerging, especially in the high-power, outdoor lighting applications market.
In the past two years, international companies such as Philips, Cree, and Osram have all embarked on the technical route of LED flip chip. As one of the leading LED chip manufacturers in China, Huacan Optoelectronics also regards flip chip as an important part of its “core†strategy.
It is worth mentioning that Huacan Optoelectronics successfully developed the second generation of flip-chip "Yao" series and successfully launched it to the market. The main application segments are: high-power lighting, headlights, flashlights and TV backlights.
Flip-chip "Yao" series of second-generation products, optimized epitaxy and chip technology, DBR as a reflective layer carrying the relevant process, and optimized layout, improve chip light-emitting area and current expansion capability. Achieve product innovation, with excellent optoelectronic performance, improve chip efficacy and reliability.
In particular, the reliability of post-packaging aging is highly recognized by the domestic packaging market, and as a result, bulk orders for packaging manufacturers have been obtained. After being introduced to the market in 2016, the client's feedback on the efficacy and aging reliability performance of this product is more obvious. Cooperation with international companies is also going on smoothly.
The second generation of "Yao" series flip chip products contain flip-chip products of different powers, and the current operating status in the factory is good. The product's light efficiency and reliability are at the leading level, providing flip-chip solutions for different package formats, which are favored by large customers at home and abroad.
Advantages of the flip chip "Yao" series:
1, low chip thermal resistance, can achieve super current use;
2, better chip light extraction, providing high light efficiency;
3, no gold wire, high-density integration.
The problem of the flip chip "Yao" series solves the problem:
1. No need for gold wire to solve the large integration size requirements of customers;
2, can achieve chip-level packaging, compact structure;
3, high lumen density, low lumen output cost;
4, good reliability and performance, to provide customers with a more reliable and stable packaging.
Based on the unique innovation of the flip-chip "Yao" series of second-generation products, the market has strong competitiveness and is highly praised by customers. Huacan Optoelectronics decided to bring this product to "competition" 2016 Gaogong LED Gold Award for the "Innovative Product Award".
About Huacan Optoelectronics
Founded in 2005, Huacan Optoelectronics Co., Ltd. is a leading LED chip supplier in China. We are committed to research, development, production and sales of high-quality LED epitaxial materials and chips. We have internationally leading technology research and development capabilities and mature production processes, and continue to innovate based on customer needs. At present, we serve customers all over the country and our products have been successfully applied to many key projects in China.
The company will continue to expand investment, continue to introduce international advanced equipment, expand production scale, and occupy the dominant position of market competition.
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