Beken's wireless audio SoC development blueprint

CEVA (NASDAQ: CEVA), the world's leading provider of cellular, multimedia and wireless connectivity DSP IP platforms, announced that Beken CorporaTIon, a leading provider of wireless application integrated circuit (IC) in China, has acquired the CEVA-TeakLite-4 DSP and The RivieraWaves Sense 802.11n Wi-Fi platform is licensed for the development of highly integrated wireless audio system-on-chip (SoC). This latest agreement is based on the successful deployment of CEVA's Bluetooth IP in Beken's high-volume wireless audio SoC.

Broadcom's wireless audio SoC development blueprint will leverage the powerful processing power and ultra-low power consumption of the CEVA-TeakLite-4 DSP to combine Wi-Fi, Bluetooth and audio capabilities in a single core, significantly reducing the cost of its future wireless audio SoCs. System complexity.

Dawei Guo, Vice President of Engineering Technology at Beken, said: "We are pleased to further expand our strategic partnership with CEVA to include CEVA-TeakLite-4 DSP and Wi-Fi IP in our wireless audio product development blueprint. CEVA The “one-stop” wireless audio solution is extremely attractive, enabling us to bring cost-effective wireless audio SoCs to market efficiently and easily.”

Aviv Malinovitch, vice president and general manager of the connected business unit at CEVA, said: "We have signed a comprehensive licensing agreement with Beken, one of China's fastest growing semiconductor companies. This is how innovative companies use our extensive DSP and wireless. A good example of connecting a portfolio of IP products to provide competitive differentiated products. We look forward to continuing to develop a partnership with Beken to meet its future wireless connectivity and DSP product needs."

CEVA's one-stop wireless audio solution combines comprehensive audio and voice software for Bluetooth and Wi-Fi with full PHY and MAC layer solutions to deliver flexible, highly integrated platform products. CEVA-TeakLite-4 DSP efficiently handles the most demanding audio, voice and wireless connection use cases, supporting Bluetooth Smart and Bluetooth Smart Ready, Wi-Fi 802.11a/b/g/ n/ac, ultra low power Always-on applications, and high-end audio/voice processing. For more information, please visit the company website.

About Broadcom

Beken Corpora TIon is China's leading provider of wireless application ICs, using advanced RF-CMOS transceiver technology to develop highly integrated, high-performance semiconductor products. Founded in February 2005, Beken is headquartered in Zhangjiang Hi-Tech Industrial Park, Pudong New Area, Shanghai, China, and has customer support offices in Shenzhen, Taipei and Hong Kong. For more information, please visit the company website.

About CEVA

CEVA is a leading provider of cellular communications, multimedia and wireless connectivity technologies to semiconductor companies and OEM manufacturers in the mobile communications, consumer electronics, automotive and IoT markets. Our DSP IP product line includes a comprehensive range of platforms for multimode 2G/3G/LTE/LTE-A baseband processing for terminals and base stations, computer vision and computational image processing for any camera-equipped device, and multi-faceted Advanced audio/voice processing and ultra-low power Always-on/sensing applications for the IoT market. In the connectivity arena, we offer the industry's broadest range of IP coverage for Bluetooth (Smart and Smart Ready), Wi-Fi (802.11 b/g/n/ac to 4x4), and serial storage (SATA and SAS). CEVA's IP is used in one-third of the world's mobile phones, from top mobile phone OEMs such as Samsung, Huawei, Xiaomi, Lenovo, HTC, LG, Coolpad, ZTE, Micromax and Meizu. To learn more about CEVA, please visit the company website.

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