OFweek Semiconductor Lighting Network February 21 news: NeoPac Opto (NeoPacOpto) announced that it has successfully developed the 8-inch epitaxial chip-level LED s package (WLCSP) technology, which will be used to manufacture its polycrystalline package, single point source Ultra-high-brightness LEDs (NeoPacEmitter), combined with a patented heat-dissipating mechanism, is a System-In-Package LEDs lighting-level lighting engine (NeoPacLightEngine).
The wafer level chip package (WLCSP) is packaged and tested on the entire wafer before being cut into individual IC particles, so the packaged volume is equivalent to the original size of the IC die. Compared with the conventional chip packaging method of cutting and then sealing and measuring at least 20% of the original chip after packaging, the memory module size is not only significantly reduced, but also meets the high density requirement of the mobile device for the space of the mobile device, and the data transmission is further improved. Speed ​​and stability.
WLCSP has the following advantages:
Short data transmission path and high stability: When using WLCSP package, the circuit wiring is short and thick (marked A to B yellow line), which can effectively increase the frequency of data transmission, reduce current consumption, and improve data transmission. stability.
Good heat dissipation characteristics Because the WLCSP lacks the traditional sealed plastic or ceramic packaging, the thermal energy of the IC chip can be effectively diverged without increasing the temperature of the main body, and this feature greatly contributes to the heat dissipation problem of the mobile device.
The original chip size is the smallest package: The biggest feature of the WLCSP wafer-level chip package is to effectively reduce the package size, so it can be matched with mobile devices to meet the thin and light characteristics of portable products.
This technology is used in LED lighting engines for general lighting and is scheduled to be officially launched in volume production in the first half of 2011.
[Edit: Vessel]
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