The power requirements of modern chips are deeply tied to the overall system demands. With the rapid evolution of integrated circuits and the rising need for portable electronic devices, designers can no longer focus solely on speed and area optimization. Instead, power consumption has become a critical factor, especially in battery-powered systems. Extending battery life and ensuring longer operational time are key objectives, and many design decisions—ranging from component selection to state machine configuration—directly influence power usage.
1 Basic Concept of FPGA Power Consumption(1) Components of Power Consumption Power consumption in FPGAs is typically divided into two main categories: static power and dynamic power. Static power arises from leakage currents within transistors, including source-to-drain and gate-to-substrate leakage. Dynamic power, on the other hand, results from the charging and discharging of capacitors during switching activities. This type of power depends on factors such as voltage, capacitance, and operating frequency, which can be expressed by equation (1) [1].
(2) Static Power Consumption Static power is primarily due to leakage current, which exists even when the chip is not actively performing operations. This current flows through the three terminals of a transistor, as illustrated in Figure 1. It consists of two components: the source-to-drain leakage current (ISD) and the gate-to-substrate leakage current (IG). The magnitude of leakage is inversely proportional to the channel length and the thickness of the gate oxide [2].
Figure 1 Composition of static power consumption
The primary source of static power is the source-to-drain leakage current. Even when the MOS transistor is off, there is always some current flowing between the source and drain. As semiconductor processes advance and transistors shrink, the channel length decreases, leading to higher leakage currents. This leakage increases exponentially with temperature, making it a major contributor to power consumption in modern FPGAs.
(3) Dynamic Power Consumption Dynamic power is caused by the charging and discharging of internal node capacitances. It is influenced by three main factors: node capacitance, core voltage, and operating frequency. The relationship is directly proportional, as shown in equation (1). In FPGAs, dynamic power mainly comes from memory, logic blocks, clock distribution, and I/O interfaces. Typically, more than 90% of the total system power is attributed to dynamic power, making its reduction a crucial step in lowering overall power consumption.
(4) Benefits of Reducing Power Consumption 1. Lower power consumption leads to simpler and more cost-effective power supply designs, reducing the number of components and PCB space. 2. Reduced power means lower junction temperatures, minimizing the risk of thermal runaway and decreasing the need for heat sinks or cooling fans. 3. Lower temperatures improve system reliability and reduce electromagnetic interference (EMI) by enabling smaller or no cooling components. 4. A 10°C decrease in operating temperature can double the device’s lifespan, making long-term performance more predictable and stable.
Therefore, reducing power consumption in FPGAs is essential for improving system performance, reducing size, lowering costs, and enhancing product quality and longevity.
(5) Strategies to Reduce FPGA Power Consumption The power consumption of an FPGA is made up of both static and dynamic components. To reduce power, both types must be addressed. Static power is closely related to temperature and process technology. Semiconductor manufacturers use advanced low-power fabrication processes to minimize leakage, while designers can also manage temperature through proper cooling and circuit layout.
Dynamic power, which dominates in most FPGA applications, comes from memory, logic, clocks, and I/Os. Several techniques can be used to reduce this:
1. Choosing the right I/O standard can significantly cut power. For example, using lower drive strength or lower voltage standards reduces power consumed by output drivers and external matching networks. If high-speed I/O is required, setting the default state appropriately can help minimize unnecessary current flow through termination resistors.
2. Optimizing control logic, such as using chip select or clock enable signals, can prevent unnecessary transitions on data buses. Implementing "data enable" at the board level instead of on the chip itself can also reduce processor activity, allowing it to remain in standby mode longer. Using CPLDs to handle simple tasks offloads the main processor, further saving power.
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