[Source: "High - tech LED - Technology and Applications" November issue Reporter / He Wei ]
The technical route of LED light source is mainly focused on high power, high brightness and small size. Since too many active heat dissipation mechanisms cannot be adopted, the requirements for heat dissipation efficiency are more manifested in the passive heat dissipation mode.
At present, the heat dissipation substrate with high heat dissipation and precision size has been recognized by the industry as the mainstream way of LED heat dissipation in the future.
Founded in 1997, Heding Circuit was the first to engage in multi-layer Circuit Board pressing and processing. In 2009, it was involved in the field of LED heat-dissipating aluminum-based circuit boards. "The production process and press-fitting processing of aluminum-based circuit boards are relatively close, and the industry's correlation is relatively strong. This is the advantage of our involvement in LED heat-dissipating aluminum substrates," said Wen Kemin, general manager of Dongguan Heding Circuit Co., Ltd.
COB brings new opportunities
The aluminum-based circuit board is composed of a copper foil, a thermally conductive insulating layer and a metal substrate. The structure thereof is divided into three layers: the circuit layer (ie, copper foil) is usually etched to form a printed circuit, so that the components of the component are connected to each other. The circuit layer is required to have a large current carrying capacity, so that a thick copper foil should be used, and the thickness is generally between 35 μm and 280 μm.
The thermal conductive insulation layer is generally composed of special polymer filled with special ceramics, mainly PP and PT. PP is resin plus thermal conductive powder, the thermal conductivity is about 0.7, PT is composed of glass fiber cloth and resin, and the thermal conductivity is 0.7. Between ~3W/MK, it has the advantages of good heat transfer effect and insulation.
Wen Kemin emphasized that the thermal insulation layer is the core technology of the aluminum substrate. Once the insulation layer has problems, the entire circuit board will be short-circuited.
In the past, the circuit board of Heding Circuit was mainly designed for SMD package form. In recent years, in order to seek a lower-cost production process and transfer the pressure of gross profit downturn, the COB package form with lower cost and better heat dissipation has gradually entered the field of LED enterprises.
Compared with SMD package, COB substrate has high technical content and is difficult to process. The COB substrate belongs to a double-sided metal sandwich panel with lines on both sides. The metal material such as aluminum/copper is inlaid in the middle, and it is pressed together. I want to be a three-dimensional circuit board. Wen Kemin said that this is also the case of Heding Circuit. The advantage of pressing experience.
As early as 2009, this integrated high-power package form of COB has already appeared, but since it was still a high-end product at that time, it has not been promoted, and it has been promoted and applied since last year.
Since the heat source of the COB is directly connected to the aluminum of the heat sink, the heat propagation is fast, the heat conduction link is reduced, and the heat dissipation problem can be well solved. Wen Kemin revealed that Heding Circuit is currently doing some special treatment for COB to speed up heat dissipation and applied for related patents.
Two-step strategy
"At present, the aluminum substrate of Heding circuit has been tested and the thermal conductivity exceeds 10W/MK." Wen Kemin said that the heat dissipation substrate has different designs depending on the circuit design, LED type and power size, and the reliability and price of the product are decided. The most important specification for thermal design.
The domestic aluminum-based circuit board market is highly competitive, and the market price has dropped by about 10% compared with last year. Wen Kemin said that the competition for SMD light strips is the most intense, and Zhongshan's offer has been lower than its cost price. However, SMD light strips are the largest market segment for shipments. For this reason, Heding Circuit has developed a two-step strategy: low to low and high to high.
Unfinished
For more information, please refer to "High - tech LED - Technology and Applications" November issue
The technical route of LED light source is mainly focused on high power, high brightness and small size. Since too many active heat dissipation mechanisms cannot be adopted, the requirements for heat dissipation efficiency are more manifested in the passive heat dissipation mode.
At present, the heat dissipation substrate with high heat dissipation and precision size has been recognized by the industry as the mainstream way of LED heat dissipation in the future.
Founded in 1997, Heding Circuit was the first to engage in multi-layer Circuit Board pressing and processing. In 2009, it was involved in the field of LED heat-dissipating aluminum-based circuit boards. "The production process and press-fitting processing of aluminum-based circuit boards are relatively close, and the industry's correlation is relatively strong. This is the advantage of our involvement in LED heat-dissipating aluminum substrates," said Wen Kemin, general manager of Dongguan Heding Circuit Co., Ltd.
COB brings new opportunities
The aluminum-based circuit board is composed of a copper foil, a thermally conductive insulating layer and a metal substrate. The structure thereof is divided into three layers: the circuit layer (ie, copper foil) is usually etched to form a printed circuit, so that the components of the component are connected to each other. The circuit layer is required to have a large current carrying capacity, so that a thick copper foil should be used, and the thickness is generally between 35 μm and 280 μm.
The thermal conductive insulation layer is generally composed of special polymer filled with special ceramics, mainly PP and PT. PP is resin plus thermal conductive powder, the thermal conductivity is about 0.7, PT is composed of glass fiber cloth and resin, and the thermal conductivity is 0.7. Between ~3W/MK, it has the advantages of good heat transfer effect and insulation.
Wen Kemin emphasized that the thermal insulation layer is the core technology of the aluminum substrate. Once the insulation layer has problems, the entire circuit board will be short-circuited.
In the past, the circuit board of Heding Circuit was mainly designed for SMD package form. In recent years, in order to seek a lower-cost production process and transfer the pressure of gross profit downturn, the COB package form with lower cost and better heat dissipation has gradually entered the field of LED enterprises.
Compared with SMD package, COB substrate has high technical content and is difficult to process. The COB substrate belongs to a double-sided metal sandwich panel with lines on both sides. The metal material such as aluminum/copper is inlaid in the middle, and it is pressed together. I want to be a three-dimensional circuit board. Wen Kemin said that this is also the case of Heding Circuit. The advantage of pressing experience.
As early as 2009, this integrated high-power package form of COB has already appeared, but since it was still a high-end product at that time, it has not been promoted, and it has been promoted and applied since last year.
Since the heat source of the COB is directly connected to the aluminum of the heat sink, the heat propagation is fast, the heat conduction link is reduced, and the heat dissipation problem can be well solved. Wen Kemin revealed that Heding Circuit is currently doing some special treatment for COB to speed up heat dissipation and applied for related patents.
Two-step strategy
"At present, the aluminum substrate of Heding circuit has been tested and the thermal conductivity exceeds 10W/MK." Wen Kemin said that the heat dissipation substrate has different designs depending on the circuit design, LED type and power size, and the reliability and price of the product are decided. The most important specification for thermal design.
The domestic aluminum-based circuit board market is highly competitive, and the market price has dropped by about 10% compared with last year. Wen Kemin said that the competition for SMD light strips is the most intense, and Zhongshan's offer has been lower than its cost price. However, SMD light strips are the largest market segment for shipments. For this reason, Heding Circuit has developed a two-step strategy: low to low and high to high.
Unfinished
For more information, please refer to "High - tech LED - Technology and Applications" November issue
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