Express-BE is equipped with AMD embedded R series APU acceleration processor.
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Suitable for medical equipment applications such as ultrasonic and dental 3D image display
ADLINK introduces the new modular computer Express-BE, which uses the COM ExpressTM basic Type 6 board specification and is equipped with AMD's second-generation embedded R Series Accelrated Processing Unit (APU). A77E FCH chipset, which integrates traditional CPU and GPU functions on a single chip, supports up to 4 screens without the need for a separate display adapter, and has a resolution of 4k x 2k at a screen update frequency of 30Hz. It consumes about 17 watts to 37 watts. Its low power consumption and high resolution visual performance are suitable for high-performance medical imaging equipment applications such as ultrasonic and dental 3D image display.
Many medical devices require high-precision image display, enabling medical personnel to provide patients with more accurate diagnosis and medical advice, including ultrasound, X-ray or computed tomography, endoscopy, and dental high-end 3D image display aids. . The ADLINK Express-BE modular computer uses AMD R Series APU, which integrates AMD RadeonTM HD 7000G series graphics chips to support high-end visual output and image processing capabilities, and through OpenCLTM programming language and DirectCompute application programming interface. Parallel computing support can be provided to allow GPU processing to replace the work previously handled by the CPU, so that CPU resources can be used more effectively.
Henk van Bremen, director of ADLINK's modular embedded computing products division, said: "The ADLINK Express-BE module computer uses its high-end image performance not only in digital billboards, video games or blogs. Get the first color, which is more suitable for applications related to medical equipment such as high resolution, low power consumption, etc. He said: "This modular computer has a long product life cycle, which is also consistent with the needs of embedded medical applications. "
Kamal Khouri, Director of Marketing for AMD Embedded Solutions, said: "The AMD Embedded R Series APU delivers impressive performance per watt performance, and its superior computational and image processing performance is truly ADLINK Express- Ideal for BE modular computers. We are proud that through ADLINK's products, AMD's embedded solutions play a key role in providing high energy efficiency and high performance while contributing to more needs. Medical products for high-resolution image applications enter the market.'
The ADLINK Express-BE modular computer supports image output formats including an 18/24-bit dual-channel LVDS display port and three DDI display ports; in addition to the built-in integrated graphics chip, a multi-tasking PCI Express® is also available. X16 graphics bus to expand discrete graphics. In terms of memory, it provides a double-stacked SODIMM slot for up to 16GB, non-ECC DDR3L 1600/1333MHz memory; one Gigabit Ethernet port (GbE), four USB 3.0 ports, four USB 2.0 ports on the board Port, 4 SATA 6 Gb/s ports. Chaowei's R-series APUs are also equipped with a video compression engine that assists in more efficient video encoding and transfer of files with hardware.
The Express-BE modular computer is equipped with the ADLINK Embedded Intelligent Management Platform (SEMA), which can be used to access system status information, including temperature, voltage, power usage, and other important information, allowing system operators to identify the system in real time. Inactive or in a bad state, it can be processed in time to avoid system failure and minimize downtime. This intelligent management platform can be seamlessly connected with ADLINK's SEMA Cloud platform to provide remote monitoring, data communication, intelligent analysis and other functions, allowing users to remotely remove conditions. All the collected information, including the measurement data and management instructions that the sensor plays, is encrypted and transmitted by the data, so that the authorized person can read it from anywhere, anywhere.
For system integrators who require high computational performance and high-resolution image performance, outsourcing the design of computer core logic can save time in system development. Express-BE modular computers are designed to meet this need. Provide complete COM Express testing tools to facilitate system developers to accelerate the development of the required applications. These tools include the COM Express Type 6 Development Kit, which allows system integrators to perform both carrier board design and software verification; the kit includes a PCIe x16 or 2 PCIe x 8 adapter card with DB40 debug module.
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