[Shangyin Technology announces that it is among the world’s leading semiconductor companies Intel’s semiconductor equipment supply chain in Japan] Machine Tool Manufacturing Corporation SAIC Technology Co., Ltd. Reports on Czech Semiconductors, Chairman Zhuo Yongcai announced on the 28th that the company has succeeded in becoming a Toyota auto supply chain. Leading the global semiconductor industry leader Intel's semiconductor equipment supply chain in Japan.
Photo: Shanghai Bank Chairman Zhuo Yongcai
Zhuo Yongcai stressed that Shanghai entered the "Japan's most closed market supply chain," in addition to proving that product quality is recognized and that it will also help the global semiconductor industry market in the future.
In addition to the ball screw, Shanghai Wafer has already entered the supply chain of semiconductor equipment manufacturers such as TSMC. It is understood that this time, the company has rushed into the packaging and testing equipment supply chain at the back stage of semiconductors. In recent months, it has successfully rescued four famous semiconductor equipment manufacturers in Japan and can deliver Intel on time and solve the shortage of Intel's plant construction plans. Crisis.
To this end, Intel headquarters specially invited senior executives of the Bank of China Group to visit their largest plant in Phoenix, the United States. The relationship between the two companies will become increasingly close.
Intel mainly deals with the system parts manufacturing plants from Japan and the equipment manufacturing facilities in Singapore. On the other hand, Shangyin delivered the most urgent two and the remaining more than ten ball-screws to Japan in early December. After strict tests, it was found that the accuracy, quality and materials of the company were much better than those of its original Japanese suppliers.
Zhuo Yongcai pointed out that wafer manufacturing processes and equipment all require nano-level positioning. Because the investment amount is tens of billions of dollars, the requirements for equipment reliability are very stringent, and suppliers will not be easily replaced.
At present, the top three major manufacturers in Europe and the United States, such as the United States, ASML, and KLA, have replaced Japanese manufacturers and have the largest market share.
The relationship between the Shanghai-based company's large silver microsystems has been deepening the field of linear motors for more than 20 years. Since the first-stage processes are nano-level positioning, the ball-screws have no place in the former process, and these three major European and American semiconductor equipment plants are large silver microsystems. customer of.
Among them, the world's largest semiconductor equipment supplier, the American manufacturer, and the Bank Microsystems have worked closely together. The two sides jointly developed ultra-precision equipment for the next generation, and for the first time received joint support from Taiwan and Israeli technology funds.
As for the latter stage of package testing, it is still the case for Japanese manufacturers. Because Taiwan's equipment manufacturers lack basic research for long-term investment, they can only provide Taiwan automation, and the main machine for packaging and testing is still under the control of the Japanese.
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