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Royal Philips Electronics (Philips) has introduced two new products to help original equipment manufacturers (OEMs) improve the mobile multimedia experience for consumers. First, with Philips' new ultra-thin sound panel technology, mobile devices and audio manufacturers are free to design innovative and superior sound accessories while reducing power consumption and delivering the ultimate in audio quality. The second new product in the Philips Audio Solutions portfolio is the high-performance stereo headset, which offers the highest quality over-the-ear headphones in the industry's smallest in-ear design. It is the ideal accessory for the latest generation of mobile phones, as well as music players and mobile video. Ideal for systems and gaming equipment.
The growing number of 3G users and the increasing availability of downloadable audio/video content are driving consumer demand for quality audiovisual experiences. The use of portable audio, video and gaming devices is becoming more widespread, requiring a powerful multimedia experience on the move, and manufacturers are faced with the challenge of developing increasingly complex audio accessories that look and feel Excellent sound quality matches. Philips' new sound panel and headphone technology meets this need by meeting the advanced design needs of manufacturers while meeting consumer demand for sound quality.
The core micro-speaker components of the sound panel are only 8 to 15 mm in diameter, and with the technology of super-scalability, it is possible to create products of various sizes and designs. In addition, the panel provides sound planning, allowing users to freely dominate the direction of the sound. The panel's frequency curve is extremely small and provides excellent sound pressure level (SPL) and total harmonic distortion (THD).
The headset is only 13 mm in diameter and is at least 2 mm smaller than competing products. To reduce time to market, its modular format simplifies development while providing optimal design flexibility. The speaker function is placed on a separate sound module that allows the OEM to fully control the design, post-processing and color of the handset. Operating from 20 Hz to 20 kHz, the headphones are designed to be innovative and durable, ensuring constant acoustic reverberation. At a frequency of 50 Hz, the design has a THD value of only 2%. In addition, its acoustic foundation integrates a bass channel system that provides true subwoofer, a sound that is essential for gaming devices.
The headset is now in volume production. The sound panel is expected to be launched in the second half of 2005.
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